Unlock 2 screws for DVI port, D-SUB port, Power port, and 7 screws which they fix between chassis and PCA boards, power board and IF board. Unlock the 2 screws which they fix the chassis and panel, and then pull the LVDS out. Seprate the Keypad and backcover with handħ.

Remove the backcover with hand from Product.Ħ. Remove the front bezel with hand from productĥ. Unlock the 4 screws which they fix the stand by 2# screwdriver.Ĥ. Unlock the 4 screws which they fix the VESA mounting by 2# screwdriver.ģ. Lay the monitor on the desk, remove the VESA mounting cover with hand.Ģ. List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.ģ.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:ġ. Including liquids, semi-liquids (gel/paste) and tonerĬomponents, parts and materials containing Include the cartridges, print heads, tubes, vent Plastics containing Brominated Flame RetardantsĬomponents and parts containing toner and ink, Greater than 2.5 cm in diameter or height Includes background illuminated displays with gasĬapacitors / condensers (Containing PCB/PCT)Įlectrolytic Capacitors / Condensers measuring Liquid Crystal Displays (LCD) with a surface greater

Printed Circuit Boards (PCB) or Printed CircuitĪll types including standard alkaline and lithium coinįor example, mercury in lamps, display backlights, It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).ġ.1 Items listed below are classified as requiring selective treatment.ġ.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. Product End-of-Life Disassembly Instructions

Host Intrusion Detection System (HIDS) 3.

Hp 2309m